A dicing die-bonding film in which the adhesive properties during the dicing step and the peeling properties during the pickup step are controlled so that both become good, and a production method thereof, are provided. The dicing die-bonding film in the present invention is a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material and a die bond layer on the pressure-sensitive adhesive layer, in which the arithmetic mean roughness X (.mu.m) on the pressure-sensitive adhesive layer side in the die bond layer is 0.015 .mu.m to 1 .mu.m, the arithmetic mean roughness Y (.mu.m) on the die bond layer side in the pressure-sensitive adhesive layer is 0.03 .mu.m to 1 .mu.m, and the absolute value of the difference of the X and Y is 0.015 or more.