A compact camera module mainly includes an image sensor chip, a module case and a lens module. The image sensor chip has an active surface, a back surface and a plurality of side surfaces, wherein a sensor region is formed in the active surface. A plurality of lateral contact fingers is formed on the side surfaces. The image sensor chip is plugged in a cave of the module case, a plurality of electrically contact components disposed on inside walls of the cave electrically connect the lateral contacting fingers. The lens module is mounted on the module case to seal the image sensor chip. Because the electrically contact components can replace the bonding wires to electrically connect the lateral contacting fingers, the compact camera module can be reworked and tiny.