Provided herein are hybrid-cooled electronics chassis and boards. Such boards may be plugged in a chassis and connected to a common liquid-cooling loop shared by two or more of the boards inside that chassis. Liquid cooling conduits between the electronics board/module and the chassis are engaged and disengaged with little or no manual intervention. For instance, the connections between such cooling conduits may utilize quick coupling connectors that allow for automatic or near automatic engagement and disengagement upon the engagement of the electronics board/module with the electronics chassis. In one arrangement, a chassis includes a base portion that has a fan, liquid cooling system and heat exchanger mounted thereon. An electronics module is selectively engageable with the base portion in a manner to have air displaced across the electronics module when engaged as well establish liquid flow through the electronics module when engaged.