Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst. The curable organosilicon composition yields a cured product that has a high degree of hardness and excellent transparency, crack resistance and heat resistance, and is useful as a curable silicone material, an encapsulating material for optical devices such as optical elements, an encapsulating material for other electronic devices such as semiconductor elements, and an electrically insulating coating material.