A redistribution connecting structure for solder balls is disclosed. A substrate includes a plurality of bonding pads. A plurality of dielectric layers, a redistribution conductive layer between the dielectric layer, and a plurality of solder balls are formed on the substrate. The redistribution layer has a redistribution pad disposed adjacent to one of the bonding pads without electrical connection with the redistribution pad. One of the dielectric layers covering the redistribution conductive layer has an opening to partially expose the redistribution pad, in which the opening is approximately circular and has a cut-off portion so that the opening is adjacent to an opening of another of the dielectric layers exposing one of the bonding pads without overlapping. Accordingly, bonding area of the redistribution pad for a bonding pad under one of the solder balls can be expanded to reduce stress effect.