Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.

 
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< Semiconductor device with solder balls having high reliability

< Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated

> Flexible printed wiring board

> Surface plasmon enhanced fluorescence sensor and fluorescence detecting method

~ 00600