The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to an improved connection structure for semiconductor devices. A connection structure for a semiconductor device includes: a peanut-shaped opening comprising a narrow area and one or more wide areas, wherein the narrow area is between two of the one or more wide areas; and a conductive plug for filling at least partially the peanut-shaped opening.

 
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< Semiconductor module

< Semiconductor device

> Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same

> Lead frame, semiconductor device using same and manufacturing method thereof

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