An implantable microstimulator includes a plastic housing having a first
end and a second end; an electronic subassembly disposed within the
housing; a first electrode disposed at the first end of the plastic
housing and in electrical communication with the electronic subassembly;
and a second electrode disposed at the second end of the plastic housing
and in electrical communication with the electronic subassembly. The
plastic housing, first electrode, and second electrode form a
hermetically sealed structure around the electronic subassembly.