A package assembly (18) that is selectively coupled to a burn-in apparatus (228P) during a burn-in process includes a pin-out (20) having an array of contacts (22) including a set of first contacts (222F) and a set of second contacts (222S). The first contacts (222F) are required for the burn-in process, and are each adapted to be in contact with a corresponding contact member (232P) of the burn-in apparatus (228P) during the burn-in process. The second contacts (222S) are not required for the burn-in process. The second contacts (222S) do not contact any of the contact members (232P) during the burn-in process. The contact members (232P) are arranged at a first pitch. In various embodiments, the array of contacts (22) is arranged at a second pitch that is smaller than the first pitch.