A plurality of wiring patterns are formed so as to extend in parallel with
each other. A plurality of test terminals are formed in a substantially
rectangular shape such that respective widths thereof increase toward
respective one sides from respective ends of the plurality of wiring
patterns. The plurality of test terminals in each group are arranged so
as to be aligned along a length direction of the wiring patterns. The
wiring patterns are formed so as to be longer in the order, and the test
terminals are further away from a mounting region in the order. An
interval (width of a plating resist) between the test terminals in each
group and the wiring patterns in the other group adjacent thereto is set
to decrease in the order.