An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula: --(R.sup.1.sub.2SiO).sub.n-- wherein, R.sup.1 is an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of R.sup.2.sub.3SiO.sub.1/2 units wherein, R.sup.2 is a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiO.sub.2 units, and/or R.sup.2SiO.sub.3/2 units wherein, R.sup.2 is as defined above, in which at least two of all the R.sup.2 groups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.