A method for manufacturing a conductive film as well as the structure thereof and a probe card using the same are provided in the invention. The conductive film is substantially a stacked structure of a specific thickness formed by the adhering and stacking of at least a substrate in a vacuum environment by the use of surface processing and mechanical healing whereas each substrate has an array of metal micro-threads formed thereon, in which the plural metal micro-threads, each being wrapped in an insulating film, are arranged on the substrate to form the array in a unidirectional and single-layered manner by the use of a LIGA process and polymer thin film technology. In an exemplary embodiment, the insulating film can be a polymer thin film of high dielectric constant, being made of a material such as polydimethylsiloxane (PDMA) or polyimide (PI); and the metal micro-thread is made of a high conductivity and high strength Ni--Co alloy. Moreover, the so-formed conductive film can be cut into any desired dimensions by the use of an energy beam, such as laser beam, ion beam and plasma beam, etc. while combining the conductive film with a panel so as to be used for forming a probe card with large area detection ability that is low-cost, ease-to-maintain and capable of being adapted for wafers of various bonding pad arrangements.