A hermetic lead connector assembly includes a hermetic lead connector having an open end, a lead connector outer surface and a lead connector inner surface defining a lead aperture and a rigid sleeve is disposed about the hermetic lead connector outer surface. The hermetic lead connector has one or more electrically conducting contact rings spaced apart by electrically insulating rings. The hermetic lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface. The rigid sleeve has an aperture that exposes a portion of the one or more electrically conducting contact rings.