A manufacturing method and an electronic module manufactured according to the method including an assembly with two insulating sheets and an electronic element. A first insulating sheet constituting one of the faces of the module including at least one window in which the electronic element is housed, one face of said element levelling the surface of said first sheet and appearing on the exterior face of the module. The second insulating sheet constitutes the other face of the module. The module includes an adhesive film which extends over a region covering at least the outline of the window of the element and is situated in a region situated between the first sheet and the second sheet. The module can also include at least one electronic circuit placed between the two insulating sheets and connected to the element on the conductive connection areas located on the interior face of the element.