A method of forming a photoresist pattern, capable of improving an
adhesion property of the photoresist pattern formed on a substrate,
includes forming a photocatalytic layer on a substrate, forming a
negative-type photoresist layer on the photocatalytic layer, exposing the
photoresist layer to ultraviolet rays, heat-treating the photoresist
layer, and developing the photoresist layer to form the photoresist
pattern. Thereby, applying the photocatalytic layer formed on various
substrates, the photoresist pattern has excellent adhesion property and
is capable of ensuring a high aspect ratio.