A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 .mu.m, and the glass powder is a Bi.sub.2O.sub.3--SiO.sub.2--B.sub.2O.sub.3 type glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.

 
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