A modular electronic cooling system with moving parts, composed of a base unit and individual modules inserted into this base unit in respect to the expected upper limit of the heat load may utilize thermoelectric power generation and the heat load itself to allow for operation independent of any external power source. By the same mechanism the cooling system scales within a range automatically reacting to and dissipating a dynamic heat load via forced convection, and doing so passively, without the need for specific programming. This cooling system uses porous material or multi-layered mesh parts, thermoelectric components, a modular assembly system and independent enclosure parts for described porous material or multi-layered mesh, an electronics control system that may be passively activated, and a motor assembly. Altogether the system provides maximum efficiency in terms of form factor.