Memory die are provided with programmable chip enable circuitry to allow
particular memory die to be disabled after packaging and/or programmable
chip address circuitry to allow particular memory die to be readdressed
after being packaged. In a multi-chip memory package, a memory die that
fails package-level testing can be disabled and isolated from the memory
package by a programmable circuit that overrides the master chip enable
signal received from the controller or host device. To provide a
continuous address range, one or more of the non-defective memory die can
be readdressed using another programmable circuit that replaces the
unique chip address provided by the pad bonding. Memory chips can also be
also be readdressed after packaging independently of detecting a failed
memory die.