A positive photosensitive resin composition, includes: (A) a resin
containing an acid-dissociable group having a specific acetal structure
as defined in the specification, which is alkali-insoluble or sparingly
alkali-soluble and becomes alkali-soluble when the acid-dissociable group
is dissociated; (B) a compound capable of generating an acid upon
irradiation with actinic rays or radiation; (C) a crosslinking agent; and
(D) an adhesion aid, and a cured film forming method uses the same.