A seal ring is provided between a region where a circuit is formed on a semiconductor substrate and a dicing region. The seal ring has a portion where sealing layers of which the cross sectional form is in T-shape are layered and a portion where sealing layers of which the cross sectional form is rectangular are layered.

 
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< Semiconductor device and a method of manufacturing the same

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> Substrate for mounting semiconductor element and method of manufacturing the same
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