It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): ##STR00001## wherein R.sup.1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.