Methods of fabricating a microelectromechanical systems (MEMS) device with
reduced masking and MEMS devices formed by the same are disclosed. In one
embodiment, a MEMS device is fabricated by laminating a front substrate
and a carrier, each of which has components preformed thereon. The front
substrate is provided with stationary electrodes formed thereover. A
carrier including movable electrodes formed thereover is attached to the
front substrate. The carrier of some embodiments is released after
transferring the movable electrodes to the front substrate. In other
embodiments, the carrier stays over the front substrate, and serves as a
backplate for the MEMS device. Features are formed by deposition and
patterning, by embossing, or by patterning and etching. In some
embodiments in which the MEMS device serves as an interferometric
modulator, the front substrate is also provided with black masks to
prevent or mitigate bright areas in the actuated state of the MEMS
device. Static interferometric modulators can also be formed by shaping
or preformation and lamination. The methods not only reduce the
manufacturing costs, but also provide a higher yield. The resulting MEMS
devices can trap smaller volumes between laminated substrates and are
less susceptible to pressure variations and moisture leakage.