A method and apparatus adapted to cool a circuit board in a rack-mountable housing includes transferring heat from a heat source on the board to a primary heat storage medium positioned at an edge of the board or within a rack-mountable housing using at least one heat pipe, transferring heat from the primary heat storage medium to a secondary heat storage medium positioned in the rack-mountable housing through contacting surfaces of the primary and secondary heat storage mediums, transferring heat from the secondary heat storage medium to a heat exchanger, which may be positioned within the rack-mountable housing, using at least one heat pipe, and cooling the heat exchanger. A method and apparatus adapted to cool a printed circuit board includes transferring heat from a heat source on the board to a heat exchanger positioned in the rack-mountable housing using at least one heat pipe, and cooling the heat exchanger.