This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component (6) embedded in an insulating-material layer (1), which has a first contacting surface, in which there are first contact terminals (7), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. In addition, the component (6) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal (7'), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.