A method of the present invention is used for the high-rate deposition of materials, such as carbon, silicon, metals, metal oxides, and the like, onto a metal substrate defined by a metal tape. The particles of the material are mixed with fluid and are injected against the metal tape at high pressure and high velocity. The particles of the material form a current collection surface of the metal tape. The metal tape is used as cathode or anode combined with a separator to form a fuel cell of a secondary battery, metal-ceramic membranes, film composite metal-ceramic materials for electronic devices.