There is disclosed apparatus for routing signals between at least one PCB within a test head and a socket card assembly. In an embodiment, the apparatus may include at least one flexible circuit electrically connecting first and second sides of the PCB and the socket card assembly with one another, and the flexible circuit having a defined shape configured to interface with the socket card assembly and the PCB along substantially perpendicular planes. Methods of routing signals between at least one PCB within a test head and a socket card assembly are disclosed. In one embodiment, a method may include electrically connecting first and second sides of the PCB and the socket card assembly with one another with at least one flexible circuit having a defined shape configured to interface with the socket card assembly and the PCB along substantially perpendicular planes. Other embodiments are also disclosed.