A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array.