In one embodiment a thermal dissipation heat slug sandwich includes a circuit board, a circuit package having an integrated heat slug mounted to an obverse side of the circuit board, and a lower heat sink plate on a reverse side of the circuit board thermally coupled to the heat slug and a housing enclosing the circuit board An upper heat sink plate may be mounted to the obverse side of the circuit board to cover the circuit package. The upper heat sink plate thermally coupled to the lower heat sink plate through the circuit board. An insulating cover may also be provided to redirect radiant heat from the circuit package to the housing.