An apparatus and associated method for analyzing a communications link between two components on a common PCB. The communications link has a pair of through-board conductors connected by a first conductive etching on one side of the PCB. The communications link further has second etchings on an opposite side of the PCB respectively connecting each of the through-board conductors to one of the components. The first conductive etching can operably be open-circuited and connectors of an analyzer can be fitted to the through-board conductors to test the communications link between the components.