An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) ##STR00001## wherein R.sup.1 may be the same with or different from each other and is a substituted or unsubstituted C.sub.1-4 alkyl group, and R.sup.2 is a substituted or unsubstituted C.sub.1-9 monovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).