A compound comprising Formula I, or a mixture thereof, R.sub.f--OCFHCF.sub.2O--[CH.sub.2CH.sub.2O].sub.x--[C.sub.3H.sub.7O].sub.- y-A Formula I wherein R.sub.f is C.sub.nF.sub.2n+1, n is 1 to about 6, x is a mixture of positive integers and is 4 or greater, y is 0 to about 4, provided that the ratio of y to x is equal to or less than 0.25, A is R.sub.fOCHFCF.sub.2 or C.sub.mH.sub.2m+1, and m is 1 to about 24 and its use in lowering surface tension and imparting improved surface effects is disclosed.