Building panel repair apparatus generally includes a substantially planar backplate for insertion through a hole in a building panel to be repaired. A front face of the backplate is provided with adhesive for mounting the backplate to the rear side of a building panel. At least one flap is defined in the backplate such that the at least one flap is movable between an open position providing an operative with backplate positioning means to facilitate mounting of the backplate to a building panel, and a closed position providing a substrate surface for hole repair material. Other aspects of the invention include methods of repairing building panels using a building panel repair apparatus, and methods of manufacturing building repair apparatus.