A semiconductor die package including at least two heat sinks. The semiconductor die package includes a first heat sink, a second heat sink coupled to the first heat sink, and a semiconductor die between the first heat sink and the second heat sink. The semiconductor die is electrically coupled to the first heat sink and the second heat sink. The semiconductor die may also be attached to a lead.

 
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< Integrated circuit package system including honeycomb molding

< Surface mountable semiconductor package with solder bonding features

> Circuit module with thermal casing systems

> Optimization of electronic package geometry for thermal dissipation
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