Thermosetting adhesive compositions for use in e.g., particleboard or fiberboard, wherein the compositions comprise a blend of a protein-based component and a polymeric quaternary amine cure accelerant, can provide the fast tack-building and curing, as well as ultimately good bonding characteristics normally associated with synthetic resin compositions. Preferably, the polymeric quaternary amine cure accelerant is the reaction product of a polyamidoamine and epichlorohydrin.