A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH.sub.2.dbd.CH)R.sup.1.sub.2SiO.sub.1/2}.sub.L(R.sup.1SiO.sub.3/2).sub- .m(R.sup.1.sub.2SiO).sub.n{O.sub.1/2SiR.sup.1.sub.2--R.sup.2--SiR.sup.1.su- b.(3-a)(OR.sup.3).sub.a}.sub.o (1) wherein R.sup.1 represents monovalent hydrocarbon groups, R.sup.2 represents an oxygen atom or a bivalent hydrocarbon group, R.sup.3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R.sup.2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.