A process for producing an inorganic oxide organosol that has good dispersibility and low viscosity, has excellent transparency, and shows good compatibility with resin solutions, and includes the steps (A) and (B) of: (A) adding silicon alkoxide having two or more alkoxy groups bonded to a silicon atom or having one or more hydroxy groups bonded to a silicon atom and one or more alkoxy groups bonded to a silicon atom to a hydrophilic inorganic oxide sol containing a hydrophilic solvent having a boiling point (1 atm) of 100.degree. C. or less in an amount of 25 to 100% by weight in a dispersion medium to treat surface of the inorganic oxide particles in the sol; and (B) replacing the dispersion medium of the surface treated inorganic oxide sol obtained in step (A) with a non-alcoholic organic solvent in the presence of a primary alcohol having 3 to 12 carbon atoms.