Glass frits, conductive inks and articles having conductive inks applied thereto are described. According to one or more embodiments, glass frits with no intentionally added lead comprise TeO.sub.2 and one or more of Bi.sub.2O.sub.3, SiO.sub.2 and combinations thereof. One embodiment of the glass frit includes B.sub.2O.sub.3, and can further include ZnO, Al.sub.2O.sub.3 and/or combinations thereof. One embodiment provides for conductive inks which include a glass frit with no intentionally added lead and comprising TeO.sub.2 and one or more of Bi.sub.2O.sub.3, SiO.sub.2 and combinations thereof. Another embodiment includes articles with substrates such as semiconductors or glass sheets, having conductive inks disposed thereto, wherein the conductive ink includes glass frits having no intentionally added lead.