A method for structured application of a laminatable intermediate layer (9) to a substrate (1) for a semiconductor module, wherein a separating layer is indirectly or directly applied to the substrate (1) over a large surface, the intermediate layer (9) is applied to the substrate (1), including the separating layer(s), by lamination, over a large surface, the intermediate layer (9) is opened in places on the substrate (1), where recesses are provided for the intermediate layer (9), and the separating layer (8) is removed in these places.