A method is provided for conducting electricity and thermal energy in an imaging system. The method includes providing a conductive path between a plurality of components and a support structure of the imaging system, in which the support structure comprises a material consisting essentially of conductive elements disposed in a non-conductive material matrix. An imaging system is provided, with a support structure of a conductive elements disposed in a non-conductive material matrix, a plurality of components coupled to the support structure, an imaging panel disposed in the housing, and a conductive path extending through the non-conductive exterior to engage the conductive elements, wherein the conductive path is configured to conduct heat, electricity, or a combination thereof, with one or more components of the imaging system. Another imaging system is provided, with a portable panel-shaped housing, a support structure including a compound plastic, a composite material, or a combination thereof, a conductive path penetrating a non-conductive exterior to a conductive interior of the compound plastic of composite material, and an imaging panel coupled to the support structure via the conductive path.