A modular heat-radiation structure includes a module for generating heat, including a first main unit having a heat-radiation fin, fixed to the top face of the first main unit for radiating heat generated in the module and a resin-made and insulating heat shield inserted between the printed circuit board and the first main unit.

 
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< Securing device for assembling heat dissipation module onto electronic component

< Clip and heat dissipation assembly using the same

> Arrangement for cooling SMD power components on a printed circuit board

> Heat sink assembly having a clip
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