An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second component is heated with the heating part and the heat generated by the first component.

 
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< Internal access mechanism for a server rack

< Hybrid immersion cooled server with integral spot and bath cooling

> Heat sink clip and assembly

> Canister housing

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