A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to the transparent substrate with a seal. The interferometric modulator array may be exposed to the surrounding environment through an opening in either the backplate or the seal.

 
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< Electronic device having an active layer including inorganic semiconductor fine particles covered with a protective layer and producing method thereof

> Packaging a MEMS device using a frame

> Detachable substrate or detachable structure and method for the production thereof
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