The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.