The present invention relates to a polymeric compound comprising, as structural units, groups each represented by the following general formula (1); and an insulating film for a semiconductor integrated circuit which comprises the polymeric compound: --R.sub.1--C.ident.C--C.ident.C--, wherein R.sub.1 represents a group having a cage-shaped structure. The insulating film has a high heat resistance, a high mechanical strength and a low dielectric constant. In addition, the insulating film has a high stability of its dielectric constant with the elapse of time. Furthermore, the present invention can provide an interlayer insulating film for electronic devices having a high heat resistance, a high mechanical strength and a low dielectric constant which can be maintained over an extremely long period of time as well as an electronic device whose layer structure is provided with such an insulating film as a constituent thereof.