An electromagnetic interference shield for use around access panels and doors in electronic equipment enclosures includes a base and profile manufactured from an electrically nonconductive solid material such as a thermoplastic resin polymer. An electrically conductive layer of a metallized fabric is bonded to the profile to provide effective shielding and grounding functions. The underlying polymer provides elastic compliancy and resiliency to the shield. The shield may be divided into flexible fingers which can be rectangular or nonlinear shaped. The nonlinear shaped flexible fingers form nonlinear shaped slits between the fingers which provides improved EMI shielding by reducing the amount of EMI transmission that can pass through the shield. The electromagnetic interference shield may also be made from an electrically conductive material.