A method of detecting open circuit defects within an integrated circuit. The invention includes locating a conductive plate proximate to a top surface of the integrated circuit. A voltage potential is coupled to the conductive plate. The voltage potential of the conductive plate couples to open circuit interconnections within the integrated circuit. Open circuit interconnections are identified by monitoring the quiescent current conducted by the integrated circuit while controlling the voltage on the conductive plate and controlling inputs to the integrated circuit.

 
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