A system an method for managing wire leads that extend from a circuit board of a similar electronic assembly. The device includes a support tray having a top surface and a bottom surface. The circuit board is mounted to the top surface of the support tray. A planar element is provided that is positioned below the bottom surface of the support tray. The planar element engages the wire leads extending from the circuit board. The presence of the planar element causes the wire leads to extend along the bottom surface of the support tray between the bottom surface of the support tray and the planar element. As a result, the wire leads conform to the bottom of the support tray and do not occupy the space behind the circuit board.