A semiconductor lead frame and a fabricating method thereof are provided. The semiconductor lead frame includes a metal substrate, and a multi-layered plating layer including a copper-nickel alloy layer formed on the metal substrate, and a palladium or palladium alloy layer formed on the copper-nickel alloy layer.

Una struttura del cavo a semiconduttore e un metodo fabbricante di ciò sono forniti. La struttura del cavo a semiconduttore include un substrato del metallo e uno strato multi-layered di placcatura compreso uno strato della lega del rame-nichel formato sul substrato del metallo e uno strato della lega del palladio o del palladio formato sullo strato della lega del rame-nichel.
 
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> Lead frame containing leads plated with tin alloy for increased wettability and method for plating the leads

> Methods for lyophilizing and using ericoid mycorrhizal fungi
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