The invention presents a deposition method which varies the growth conditions of a film on a patterned substrate. For example, deposition conditions required for obtaining growth are determined for each of the substrate's component surfaces. Film deposition begins under the conditions used to deposit material on one of the substrate materials. Then, the growth parameters are adjusted towards desired conditions for the other substrate material as another small amount of material is deposited. The adjustment and subsequent deposition is repeated until the desired conditions for growth on the second material are met. Growth of the remainder of the film then continues under the desired deposition conditions for growth on the second material.