A microelectronic substrate having a plurality of alternating substantially planar layers of dielectric material and conductive material, and further having a first surface and a second surface, wherein the dielectric material and the conductive material layers extend substantially perpendicularly between the first and second surfaces.

Uma carcaça microelectronic que tem um plurality de alternar camadas substancialmente planar de material dieléctrico e de material condutor, e promove ter uma primeira superfície e uma segunda superfície, wherein o material dieléctrico e as camadas materiais condutoras estendem substancialmente perpendicular entre as primeiras e segundas superfícies.

 
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< Matrix type printed circuit board for semiconductor packages

< Rewritable compact disk and manufacturing method thereof

> Probe card and method of testing wafer having a plurality of semiconductor devices

> Semiconductor device having a bump electrode

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